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PC-685

PC-685

FLEXIBLE, LOW CTE, SHOCK RESISTANT EPOXY COMPOUND


PC 250 is a flexible, non-abrasive filled 100% solids epoxy system. It is a resin which exhibits low coefficient of thermal expansion and exceptional shock resistance. PC 250 is designed in such a way that the mix ratio is 1:1 by volume. It is a room temperature cure, has excellent moisture resistance, and is also machine dispensable.

Properties Uncured

Color Clear
Black or White
Viscosity, ASTM-D-2393 (c.p.s. @ 25o C) 600
2500
Specific Gravity 1:12
1:29
Mix Ratio (volume

1:1

Mixed Viscosity, ASTM-D-2393 (@ 25o C)  900-1500
Pot Life @ 25OC (100 grams) 15-20 minutes
Shelf Life @ 70o F 12 months

Properties Cured

Hardness, ASTM-D-2240(Durometer) Shore A 70
Tensile Strength, ASTM-D-638 3,500 psi
Tensile Elongation, ASTM-D-638 25%
Coefficient of Thermal Expansion 7 x 10-6
Water Absorption 0.1%
Dielectric Strength, ASTM-D-149 (volts/mil) 370
Dielectric Constant, ASTM-D-150 4.5
Dissipation Factor, ASTM-D-15 0.08
Volume Resistivity, ASTM-D-257 (ohm-cm 7 x 1012
Thermal Conductivity, (BTU*in)/(hr*ft2*ºF) 3.5
Temperature Class B

MIXING INSTRUCTIONS

Pre-mix Part A and Part B separately. Then measure 1:1 by volume (A to B).Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.

CURE SCHEDULE

Room temperature cure @75°F with full properties after 24 hours.

Demold time @ 75°F - 4 hours