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PC-661

PC-661

LIGHT WEIGHT SYNTACTIC EPOXY COMPOUND


PC 661 is a low density epoxy system. It exhibits a low dielectric constant and low shrinkage. PC 661 is suitable for use in lightweight and airborne equipment. It finds use in applications where thermal insulation is required.  

Properties Uncured

Color

White
Clear

Viscosity, ASTM-D-2393 (c.p.s. @ 25o C) 30,000
500
Specific Gravity .75
1.14
Mix Ratio (by wt.) 100:12
Mixed Viscosity, ASTM-D-2393 (@ 25o C) 10,000
Pot Life @ 25OC (100 grams) 30 minutes
Shelf Life @ 70o F 12 months

Properties Cured

Hardness, ASTM-D-2240 (Durometer) Shore D 82
Compressive Strength 12,000
Tensile Strength, ASTM-D-638 4,000 psi
Tensile Elongation, ASTM-D-638 5% maximum
Flexural Strength ASTM-D-790 4,200 psi
Coefficient of Thermal Expansion 55 x 10-6
Moisture Absorption 0.08%
Dielectric Strength, ASTM-D-149 (volts/mil) 375
Dielectric Constant, ASTM-D-150 3.3
Dissipation Factor, ASTM-D-150 0.01
Volume Resistivity, ASTM-D-257 (ohm-cm) 1 x 1012
Thermal Conductivity, BTU's 1.3

MIXING INSTRUCTIONS

Pre-mix Part A and Part B separately. Then measure 100:15 parts by weight (A to B). Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.

CURE SCHEDULE

Room temperature cure @75°F for 24 hours.

To accelerate cure: cure 1 hour @ 75ºF, then @ 200ºF for 2 hours.