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PC-235

PC-235

Flexible, Low Cte, Shock Resistant Epoxy Compound

PC 250 is a flexible, non-abrasive filled 100% solids epoxy system. It is a resin which exhibits low coefficient of thermal expansion and exceptional shock resistance. PC 250 is designed in such a way that the mix ratio is 1:1 by volume. It is a room temperature cure, has excellent moisture resistance, and is also machine dispensable

Specifications:

Color

Black
Neutral (Part A)

Viscosity, cps (ASTMD 2393) 700 (Part B PC 110B)
57000 (Part A)
400 (Part B PC 90)
Specific Gravity 0.95 (Part B PC 110B) (ASTMD 2393)
1.0 (Part B PC 90)
1.62 (Par A) (ASTMD 2393)

Compressive Strength
14500 psi (Part B PC 90) (ASTMD 695)
15000 psi (Part B PC 110B) (ASTMD 695)
Mix Ratio 100:6-7 (Part B PC 90) (By Weight)
100:9-10 (Part B PC 110B) (By Weight)
Mixed Viscosity (ASTM-D-2393 @ 25 °C) 12000 cps (Part B PC 90)
6000 cps (Part B PC 110B)
Pot Life 2.5 hours (Part B PC 110B) @ 72 °F
30 min. (Part B PC 90) @ 72 °F
Shelf Life @ 70 °F
 12 months @ 72 °F
Hardness, ASTM-D-2240 (Durometer) 88 (Part B PC 90) (ASTMD 2240-Shore D)
89 (Part B PC 110B) (ASTMD 2240-Shore D)
Tensile Strength 7000 psi (ASTMD 638)
 
Tensile Elongation
2-3 % (ASTMD 638)
Flexural Strength (ASTM-D-790) 13000 psi (Part B PC 110B) (ASTMD 790)
13000 psi (Part B PC 90) (ASTMD 790)
Coefficient of Thermal Expansion 40 x 106 (Part B PC 110B)
40 x 106 (Part B PC 90)
Service Temperature Range -55 to 155 ºC (Part B PC 110B)
-55 to 105 ºC (Part B PC 90)
Heat Distortion Point 80 °C (Part B PC 90)
155 °C (Part B PC 110B)

Dielectric Strength (ASTM-D-149)
450 V/mil (Part B PC 110B) (ASTMD 149)
450 V/mil (Part B PC 90) (ASTMD 14

Dielectric Constant
4.4 (Part B PC 110B) (ASTMD 150)
4.4 (Part B PC 90) (ASTMD 150)

Dissipation Factor
0.02 (Part B PC 110B) (ASTMD 150)
0.02 (Part B PC 90) (ASTMD 150)

Volume Resistivity (ASTM-D-257)
1.0 x 1015 ohm-cm (Part B PC 90)
5.0 x 1014 ohm-cm (Part B PC 110B)
 
Linear Shrinkage
0.002 (Part B PC 90)
0.002 (Part B PC 110B)

Cure Schedule:

Room Temp.- 24 hrs.
2 hours at 100 °C + 1 hour at 125 ° with PC 110B
Post Cure: 2 hours at 155 °C

Use Instructions:

  1. Premix material in the original container prior to use to insure any settled filler may be reincorporated.
  2. Weigh out the required amount of PC 235.
  3. Measure out the appropriate amount of material (Part A and Part B)
  4. Mix thoroughly, scraping both sides and bottom of container.
  5. Evacuate mixture at 29 in. Hg for 5- 10 minutes.
  6. Pour into mold or cavity.